Japan, April 6 -- TOSHIBA CORP,TOSHIBA ELECTRONIC DEVICES & STORAGE CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other relate... Read More
Japan, April 6 -- TOKYO ELECTRON LTD has got intellectual property rights for 'SUBSTRATE CONVEYING DEVICE.' Other related details are as follows: Application Number: JP,2024-106614 Category (FI): H1... Read More
Japan, April 6 -- MITSUBISHI HEAVY IND LTD has got intellectual property rights for 'ELECTROCHEMICAL CELL AND ELECTROLYTIC DEVICE.' Other related details are as follows: Application Number: JP,2023-0... Read More
Japan, April 6 -- HITACHI LTD has got intellectual property rights for 'BUILDING MANAGEMENT SYSTEM AND BUILDING MANAGEMENT METHOD.' Other related details are as follows: Application Number: JP,2023-0... Read More
Japan, April 6 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2023-017514 Category (FI): H0... Read More
Japan, April 6 -- TMEIC CORP has got intellectual property rights for 'PLANT FACILITY MANAGEMENT SYSTEM.' Other related details are as follows: Application Number: JP,2023-016628 Category (FI): G05B... Read More
Japan, April 6 -- TOSHIBA CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows: Application Number: JP,2023-0147... Read More
Japan, April 6 -- FUJIFILM ELECTRONIC MATERIALS USA INC has got intellectual property rights for 'ETCHING COMPOSITIONS.' Other related details are as follows: Application Number: JP,2024-094703 Cate... Read More
Japan, April 6 -- MITSUBISHI KAKOKI KAISHA LTD has got intellectual property rights for 'METHANATION REACTION DEVICE AND METHANATION REACTION METHOD.' Other related details are as follows: Applicatio... Read More
Japan, April 6 -- KUBOTA CORP has got intellectual property rights for 'OPERATION DEVICE FOR WORK VEHICLE AND WORK VEHICLE.' Other related details are as follows: Application Number: JP,2022-210887 ... Read More