US Patent Issued to Samsung Display on June 16 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,687, issued on June 16, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Na Hyeon Cha (Y... Read More

US Patent Issued to AUTOSYSTEMS A DIVISION OF MAGNA EXTERIORS on June 16 for "Flexible LED display having an optic optically coupled with an LED chip" (Michigan Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,688, issued on June 16, was assigned to AUTOSYSTEMS A DIVISION OF MAGNA EXTERIORS INC. (Aurora, Canada). "Flexible LED display having an op... Read More

US Patent Issued to Micron Technology on June 16 for "Semiconductor devices, assemblies, and associated methods" (Idaho Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,689, issued on June 16, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor devices, assemblies, and associated methods" ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Micro LED display apparatus and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,690, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Micro LED display apparatus and method of ma... Read More

US Patent Issued to Sandisk Technologies on June 16 for "High density semiconductor device including integrated controller, logic circuit and memory dies" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,691, issued on June 16, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "High density semiconductor device including integrat... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on June 16 for "Semiconductor package assembly and manufacturing method" (Chinese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,692, issued on June 16, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor package assembly and manufacturing... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Display apparatus with improved light extraction efficiency" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,694, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display apparatus with improved light extrac... Read More

US Patent Issued to ROHM on June 16 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,695, issued on June 16, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Kengo Ohmori (Kyoto, Japan). ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,696, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and met... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor structure with vertical connection structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,697, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure with vertic... Read More

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