US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,616, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Lid structure with openings to ... Read More

US Patent Issued to Hitachi Astemo on June 16 for "Power semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,617, issued on June 16, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Power semiconductor device" was invented by Hiromi Shima... Read More

US Patent Issued to Avago Technologies International Sales on June 16 for "Thermal management systems and methods for semiconductor devices" (California, Colorado Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,618, issued on June 16, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Thermal management systems and metho... Read More

US Patent Issued to INVENTION AND COLLABORATION LABORATORY on June 16 for "Semiconductor device structure with efficient heat-removal structures across the chip and monolithic fabrication method therefor" (Taiwanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,619, issued on June 16, was assigned to INVENTION AND COLLABORATION LABORATORY INC. (Taipei City, Taiwan). "Semiconductor device structure ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Package with improved heat dissipation efficiency and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,620, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package with improved heat dissipat... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,621, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Yeong... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package including heat dissipation layers" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,622, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including heat dissipa... Read More

US Patent Issued to KIOXIA on June 16 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,623, issued on June 16, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor device" was i... Read More

US Patent Issued to SK hynix on June 16 for "Semiconductor module and system including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,624, issued on June 16, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor module and system including the same" was in... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor device and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,625, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Semiconductor device and method of... Read More

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