US Patent Issued to Tokyo Electron on April 14 for "Etching method and plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,254, issued on April 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching method and plasma processing apparatus" was invented by Aki... Read More

US Patent Issued to Hitachi High-Tech on April 14 for "Plasma processing apparatus and plasma processing method" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,255, issued on April 14, was assigned to Hitachi High-Tech Corp. (Tokyo). "Plasma processing apparatus and plasma processing method" was i... Read More

US Patent Issued to Beijing E-Town Semiconductor Technology, Mattson Technology on April 14 for "Conductive member for cleaning focus ring of a plasma processing apparatus" (American, Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,256, issued on April 14, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, C... Read More

US Patent Issued to LAM RESEARCH on April 14 for "Carrier ring for floating TCP chamber gas plate" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,257, issued on April 14, was assigned to LAM RESEARCH Corp. (Fremont, Calif.). "Carrier ring for floating TCP chamber gas plate" was inven... Read More

US Patent Issued to Tokyo Electron on April 14 for "Plasma processing apparatus and plasma processing method" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,258, issued on April 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus and plasma processing method" was inven... Read More

US Patent Issued to SEMES on April 14 for "Apparatus for treating substrate and method for treating substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,260, issued on April 14, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Apparatus for treating substrate and method for... Read More

US Patent Issued to Applied Materials on April 14 for "Aligner station with lifting mechanism" (Texas Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,261, issued on April 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Aligner station with lifting mechanism" was invent... Read More

US Patent Issued to Tokyo Electron on April 14 for "Cleaning method and plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,262, issued on April 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Cleaning method and plasma processing apparatus" was invented by Yo... Read More

US Patent Issued to Lam Research on April 14 for "Apparatuses and techniques for cleaning a multi-station semiconductor processing chamber" (California, Oregon Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,263, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Apparatuses and techniques for cleaning a multi-station se... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Semiconductor processing tool and methods of operation" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,264, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor processing tool and... Read More

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