ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,189, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Direct bonding in microelectronic assemblies" was invented by A... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,190, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor packages having a coupling mem... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,191, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interposer via interconnect shapes ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,192, issued on July 14, was assigned to NXP USA Inc. (Austin, Texas). "Semiconductor device quad-flat-no-leads package with trenches for im... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,193, issued on July 14, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Isolated metal clips with structural bridge" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,194, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Multichip IC devices in glass medium and including an interconn... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,195, issued on July 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Substrate, packaged structure, and electronic dev... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,196, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Strip substrate and semiconductor package in... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,197, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Chip select wiring for a dual device package" was invented ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,198, issued on July 14, was assigned to GLOBAL UNICHIP Corp. (Hsinchu City, Taiwan) and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsi... Read More