US Patent Issued to Intel on July 14 for "Direct bonding in microelectronic assemblies" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,189, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Direct bonding in microelectronic assemblies" was invented by A... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor packages having a coupling member including a vertical wire and a metal portion extending around the vertical wire" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,190, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor packages having a coupling mem... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Interposer via interconnect shapes with improved performance characteristics and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,191, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interposer via interconnect shapes ... Read More

US Patent Issued to NXP USA on July 14 for "Semiconductor device quad-flat-no-leads package with trenches for improved soldering and method of making thereof" (Chinese, Malaysian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,192, issued on July 14, was assigned to NXP USA Inc. (Austin, Texas). "Semiconductor device quad-flat-no-leads package with trenches for im... Read More

US Patent Issued to Analog Devices on July 14 for "Isolated metal clips with structural bridge" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,193, issued on July 14, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Isolated metal clips with structural bridge" was invented... Read More

US Patent Issued to Intel on July 14 for "Multichip IC devices in glass medium and including an interconnect bridge die" (Arizona Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,194, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Multichip IC devices in glass medium and including an interconn... Read More

US Patent Issued to Huawei Technologies'Co., 'Ltd.' on July 14 for "Substrate, packaged structure, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,195, issued on July 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Substrate, packaged structure, and electronic dev... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Strip substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,196, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Strip substrate and semiconductor package in... Read More

US Patent Issued to Micron Technology on July 14 for "Chip select wiring for a dual device package" (Idaho Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,197, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Chip select wiring for a dual device package" was invented ... Read More

US Patent Issued to GLOBAL UNICHIP, TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor chiplet device and interposer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,198, issued on July 14, was assigned to GLOBAL UNICHIP Corp. (Hsinchu City, Taiwan) and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsi... Read More

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