US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Flip chip packaged devices with thermal interposer" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,169, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Flip chip packaged devices with thermal interposer" was invented ... Read More

US Patent Issued to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY, WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY on July 14 for "Display panel and mobile terminal with crack-mitigating encapsulation structure" (Chinese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,170, issued on July 14, was assigned to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Wuhan, China) and WUHAN CHINA STAR OPTOELECTRO... Read More

US Patent Issued to Intel on July 14 for "Semiconductor package with extended stiffener" (Malaysian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,171, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor package with extended stiffener" was invented by ... Read More

US Patent Issued to NXP USA on July 14 for "Integrated circuit with dielectric layer having selectively implanted stress-setting dopants" (Texas, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,172, issued on July 14, was assigned to NXP USA Inc. (Austin, Texas). "Integrated circuit with dielectric layer having selectively implante... Read More

US Patent Issued to SILICONWARE PRECISION INDUSTRIES on July 14 for "Electronic package and shielding part including semiconductor block and magnetized layer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,173, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan). "Electronic package and shielding par... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "RFSOI semiconductor structures including an electromagnetic shield layer and methods of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,174, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "RFSOI semiconductor structures incl... Read More

US Patent Issued to Teledyne e2v Semiconductors on July 14 for "Flip-chip ball grid array-type integrated circuit package for very high frequency operation" (French Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,175, issued on July 14, was assigned to Teledyne e2v Semiconductors SAS (Saint Egreve, France). "Flip-chip ball grid array-type integrated ... Read More

US Patent Issued to MURATA MANUFACTURING on July 14 for "Radio-frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,176, issued on July 14, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Radio-frequency module and communication device... Read More

US Patent Issued to DB HiTek on July 14 for "RF switch device and method of manufacturing same" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,177, issued on July 14, was assigned to DB HiTek Co. Ltd. (Bucheon-si, South Korea). "RF switch device and method of manufacturing same" wa... Read More

US Patent Issued to Semiconductor Manufacturing International (Beijing), Semiconductor Manufacturing International (Shanghai) on July 14 for "Semiconductor structure comprising sub-alignment marks" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,178, issued on July 14, was assigned to Semiconductor Manufacturing International (Beijing) Corp. (Beijing) and Semiconductor Manufacturing ... Read More

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