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US Patent Issued to BEIJING BOE SENSOR TECHNOLOGY, BOE TECHNOLOGY GROUP on April 21 for "Texture recognition module and display device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,637, issued on April 21, was assigned to BEIJING BOE SENSOR TECHNOLOGY Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Te... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,638, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More


US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 21 for "Semiconductor package structure and method for producing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,639, issued on April 21, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Semiconductor package structure and... Read More


US Patent Issued to KLA on April 21 for "Back-illuminated sensor and method of making same" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,640, issued on April 21, was assigned to KLA Corp. (Milpitas, Calif.). "Back-illuminated sensor and method of making same" was invented by... Read More


US Patent Issued to VISERA TECHNOLOGIES on April 21 for "Image sensor and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,641, issued on April 21, was assigned to VISERA TECHNOLOGIES COMPANY LTD. (Hsin-Chu City, Taiwan). "Image sensor and manufacturing method ... Read More


US Patent Issued to Canon on April 21 for "Photoelectric conversion apparatus, substrate, manufacturing method, and equipment" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,642, issued on April 21, was assigned to Canon K.K. (Tokyo). "Photoelectric conversion apparatus, substrate, manufacturing method, and equ... Read More


US Patent Issued to SAMSUNG ELECTRONICS, The Board of Trustees of the Leland Stanford Junior University of Office of the General Counsel on April 21 for "Image sensors including meta-structure for color separation and electronic devices including image sensor" (South Korean, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,643, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and The Board of Trustees of the Leland Stanf... Read More


US Patent Issued to Sony Semiconductor Solutions on April 21 for "Light receiving element, distance measurement module, and electronic equipment including a reflection film" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,644, issued on April 21, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Light receiving element, distance measurem... Read More


US Patent Issued to Canon on April 21 for "Photoelectric conversion device, imaging system, and movable body" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,645, issued on April 21, was assigned to Canon K.K. (Tokyo). "Photoelectric conversion device, imaging system, and movable body" was inven... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Image sensor" (South Korean Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,646, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Image sensor" was invented by Jungwook Lim... Read More