ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,054, issued on April 14, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD.... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,055, issued on April 14, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-do, South Korea). "Display device including a sweep driver tha... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,056, issued on April 14, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Data driving integrated circuit, display apparatus, and... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,057, issued on April 14, was assigned to Samsung Display Co. Ltd. (Yongin-Si, South Korea). "Display device" was invented by Sang Yong No ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,058, issued on April 14, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device" was invented by Shuhei Hosaka (Miaoli ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,059, issued on April 14, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Jaehoon Lee (... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,060, issued on April 14, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display device" was invented by Mangyu Park (Paju-si, ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,778, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Takashi Iwamoto... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,778, issued on April 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Takashi Iwamoto... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,779, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More