US Patent Issued to Advanced Semiconductor Engineering on April 21 for "Circuit structure" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,466, issued on April 21, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Circuit structure" was invented by ... Read More

US Patent Issued to TAIWAN ALPHA ELECTRONIC on April 21 for "Spliced pressure sensing device and splicable pressure sensing unit thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,467, issued on April 21, was assigned to TAIWAN ALPHA ELECTRONIC Co. LTD. (Taoyuan City, Taiwan). "Spliced pressure sensing device and spl... Read More

US Patent Issued to Samsung SDI on April 21 for "Hybrid circuit board and battery pack having same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,468, issued on April 21, was assigned to Samsung SDI Co. Ltd. (Yongin-si, South Korea). "Hybrid circuit board and battery pack having same... Read More

US Patent Issued to HUIZHOU VISION NEW TECHNOLOGY on April 21 for "Integrated module and intelligent device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,469, issued on April 21, was assigned to HUIZHOU VISION NEW TECHNOLOGY Co. LTD. (Huizhou, China). "Integrated module and intelligent devic... Read More

US Patent Issued to Innolux on April 21 for "Electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,470, issued on April 21, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device" was invented by Chin-Lung Ting (Miaoli... Read More

US Patent Issued to Vicor on April 21 for "Panel-molded electronic assemblies" (Massachusetts, California, New Hampshire Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,471, issued on April 21, was assigned to Vicor Corp. (Andover, Mass.). "Panel-molded electronic assemblies" was invented by Patrizio Vinci... Read More

US Patent Issued to Dell Products on April 21 for "Integrated circuit (IC) assembly including a direct connection pad structure for a surface-mount device (SMD)" (Texas Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,472, issued on April 21, was assigned to Dell Products LP (Round Rock, Texas). "Integrated circuit (IC) assembly including a direct connec... Read More

US Patent Issued to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO), CHINA AVARY HOLDING (SHENZHEN), GARUDA TECHNOLOGY on April 21 for "Circuit board and method of fabricating the same" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,473, issued on April 21, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD., CHINA AVARY HOLDING (SHENZHEN) Co. LTD. ... Read More

US Patent Issued to AT & S Austria Technologie & Systemtechnik on April 21 for "Carrier assembly and method for producing a carrier assembly" (Austrian Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,474, issued on April 21, was assigned to AT & S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Carrier assembly and method for... Read More

US Patent Issued to LG INNOTEK on April 21 for "Electric/electronic equipment and method for manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,475, issued on April 21, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Electric/electronic equipment and method for manufactu... Read More

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