India, July 26 -- Samsung Electronics and Broadcom signed a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure, Samsung said in a statement.
The companies expect the collaboration to exceed $200 billion over the next five years through 2030, underscoring the scale and importance of their joint efforts.
On the memory front, Samsung and Broadcom plan to pursue a strategic partnership for the supply of industry-leading solutions, including High Bandwidth Memory (HBM), to power Broadcom's next-generation AI accelerators.
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In foundry, the collabo...