Nowes Technology Corporation Limited secures contract for Procurement of 0729-254OIT570558/02 Ultra high accuracy die bonder (for Micro Transfer Printing)(2)

China, Dec. 3 -- China based Nowes Technology Corporation Limited has secured contract from Institute of semiconductors,CAS for Procurement of 0729-254OIT570558/02 Ultra high accuracy die bonder (for Micro Transfer Printing)(2). The value of the contract is not disclosed.

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