Extripod Electronics Technology Limited secures contract for Procurement of 0705-264506026022 ICB for High-Precision Flip-Chip Bonder (Cu Pillar) of Shanghai Xin yuan Innovation Center(2)

Japan, July 1 -- Japan based Extripod Electronics Technology Limited has secured contract from Shanghai Xinyuan Innovation Center for Procurement of 0705-264506026022 ICB for High-Precision Flip-Chip Bonder (Cu Pillar) of Shanghai Xin yuan Innovation Center(2) . The value of the contract is not disclosed .

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