Engis (UK) Ltd secures contract for Special-purpose machine tools - Delivery of two identical advanced surface grinding systems designed specifically for grinding semiconductor substrates such as gallium nitride (GaN) and silicon carbide (SiC)

Poland, Dec. 8 -- Poland based Engis (UK) Ltd has secured contract from Instytut Wysokich Cisnien Polskiej Akademii Nauk for Special-purpose machine tools - Delivery of two identical advanced surface grinding systems designed specifically for grinding semiconductor substrates such as gallium nitride (GaN) and silicon carbide (SiC). The value of the contract is worth 66596900 PLN.

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