DISCO HI-TEC (CHINA) CO., LTD. secures contract for Procurement of 0613-254025125961 Yibu Semiconductor Co., Ltd. Wafer Back Grinding(2)

China, Dec. 11 -- China based DISCO HI-TEC (CHINA) CO., LTD. has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254025125961 Yibu Semiconductor Co., Ltd. Wafer Back Grinding(2). The value of the contract is not disclosed.

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