New Delhi, May 25 -- Huawei Technologies Co. said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co., potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.

Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semiconductor Manufacturing International Corp. can produce. Huawei will start making 1.4-nanometer chips by 2031 with its own "LogicFolding" technology, Huawei's semiconductor chief He Tingbo said on Monday, while TSMC has previously said that it will begin mass production of the same product in 2028.

If Huawei can manage to make 1.4nm semiconduct...