Bhubaneswar, May 30 -- The Odisha government, Intel Corporation, and 3DGS have signed a Memorandum of Understanding (MoU) to establish an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar-Khurda region of the state.

The Ministry of Electronics and IT (MeitY) described the project as one of the largest high-technology manufacturing investments in India to date.

The proposed facility will focus on advanced packaging glass core substrates, high-density interconnect substrates, and associated semiconductor technologies. Intel will provide technology know-how and process expertise.

The project is expected to contribute to capability development, ecosystem growth, and export-oriented manufacturing in India.

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