Srinagar, Sept. 16 -- India's semiconductor programme is typically narrated through fab and ATMP capacity. That framing captures investment momentum but misses where the strategic vulnerability actually sits. A fab is at the process level, a continuous consumer of chemistry (deposition, etch, lithography, CMP, cleaning and doping steps) with electronic-grade process gases (bulk and specialty, dopant and etch gases typically at 5N-6N purity), wet chemicals (sulfuric-peroxide and ammonia-peroxide cleans, HF), CMP slurries, photoresists, and substrates with contamination tolerances specified in parts-per-billion or -trillion for critical metallic and particulate impurities. A marginal purity deviation may not cause a visible failure immediat...