Japan, March 25 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'WOUND BODY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:
Application Number: JP,2022-045593
Category (FI): H01L23/30@R,H10W74/47,B32B27/00@B,B32B27/20@Z,B32B27/38
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 22, 2022
Publication Date: Oct. 4, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....