Japan, March 6 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows:
Application Number: JP,2021-103055
Category (FI): B24B49/12,H01L21/78@F,B24B27/06@M,H10P58/00@F
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 22, 2021
Publication Date: Jan. 10, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....