Japan, Feb. 6 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows:
Application Number: JP,2021-191013
Category (FI): H10P52/00@R,B23K26/364,B24B27/06@M,B24B1/00@Z,H01L21/304,601@Z,H10P95/60@Z,H10P54/20,201,H10P52/00@T
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 25, 2021
Publication Date: June 6, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....