Japan, Nov. 10 -- TOKYO SEIMITSU CO LTD has got intellectual property rights for 'WAFER PROCESSING DEVICE.' Other related details are as follows:
Application Number: JP,2022-052575
Category (FI): B23Q11/14,B24B41/06@L,B24B55/00,H10P52/00@C,H01L21/304,631
Stage: Grant (IP right document published.)
Filing Date: March 28, 2022
Publication Date: Oct. 11, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....