Japan Intellectual Property Rights: WAFER PROCESSING DEVICE AND WAFER PROCESSING METHOD

Japan, Sept. 3 -- SHIBAURA MECHATRONICS CORP has got intellectual property rights for 'WAFER PROCESSING DEVICE AND WAFER PROCESSING METHOD.' Other related details are as follows:

Application Number: JP,2023-130354

Category (FI): H10P50/60@R,H10P70/00,201@M,H10P70/00,201@L,H10P70/00,108@L,H10P70/00,103@A,H01L21/304,648@L,H01L21/304,651@M,H01L21/304,651@L,H01L21/304,643@A,H01L21/306@R

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 9, 2023

Publication Date: April 11, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....