Japan, Nov. 7 -- DENSO CORP has got intellectual property rights for 'WAFER MANUFACTURING METHOD.' Other related details are as follows:
Application Number: JP,2022-128099
Category (FI): H01L21/304,611@Z,B23K26/53
Stage: Grant (IP right document published.)
Filing Date: Aug. 10, 2022
Publication Date: June 20, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....