Japan, July 1 -- DISCO CORP has got intellectual property rights for 'WAFER GRINDING METHOD.' Other related details are as follows:
Application Number: JP,2022-083480
Category (FI): H01L21/304,631,B24B7/04@A,B24B41/06@L,H10P52/00@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: May 23, 2022
Publication Date: Dec. 6, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....