Japan Intellectual Property Rights: WAFER EDGE PROTECTION FILM FORMING METHOD, PATTERNING PROCESS, AND COMPOSITION FOR FORMING WAFER EDGE PROTECTION FILM

Japan, Oct. 29 -- SHIN ETSU CHEM CO LTD has got intellectual property rights for 'WAFER EDGE PROTECTION FILM FORMING METHOD, PATTERNING PROCESS, AND COMPOSITION FOR FORMING WAFER EDGE PROTECTION FILM.' Other related details are as follows:

Application Number: JP,2022-127751

Category (FI): H01L21/30,564@D,C30B29/06@Z,H01L21/312@A,H01L21/302,105@A,C30B33/08

Stage: Grant(IP right document published.)

Filing Date: Aug. 10, 2022

Publication Date: Feb. 26, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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