Japan, March 24 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER DIVIDING METHOD.' Other related details are as follows:

Application Number: JP,2021-126527

Category (FI): H01L21/78@M,H01L21/78@V,H10P58/00@M,H10P58/00@V

Stage: Grant (IP right document published.)

Filing Date: Aug. 2, 2021

Publication Date: Feb. 14, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....