Japan, Aug. 6 -- SEIKO EPSON CORP has got intellectual property rights for 'THIXOMOLDING MATERIAL AND METHOD OF PRODUCING THIXOMOLDING MATERIAL.' Other related details are as follows:

Application Number: JP,2021-213932

Category (FI): B22F1/105,B22D17/00,318,B22D17/00,540,B22F1/00@N,B29C45/00,B82Y40/00,B82Y30/00,B22F1/17

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 28, 2021

Publication Date: July 10, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....