Japan, Aug. 12 -- CHUO UNIV has got intellectual property rights for 'THIN FILM ADHESION STRENGTH EVALUATION METHOD AND THIN FILM ADHESION STRENGTH EVALUATION DEVICE.' Other related details are as follows:
Application Number: JP,2022-178435
Category (FI): H10P74/20@Q,H10P74/20@Z,H10W20/44@X,H10W20/40@Z,G01N19/04@Z,H01L21/90@Z,H01L21/66@Q
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 7, 2022
Publication Date: May 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....