Japan, July 14 -- POLYTEC PT GMBH has got intellectual property rights for 'THERMAL-CONTACT AND FILLING MATERIAL, AND STORAGE BATTERY ASSEMBLY HAVING THERMAL-CONTACT AND FILLING MATERIAL.' Other related details are as follows:
Application Number: JP,2023-106660
Category (FI): C08L91/00,C08L71/00@Z,C08K3/22,H10W40/60@M,C09K5/14,101@Z,H01M50/204,401@H,H10W40/25,H01L23/36@M,H01L23/36@D,C08K5/541
Stage: PROBLEM TO BE SOLVED: To provide a thermal-contact and filling material which is suitable for large-scale applications and better withstands potential mechanical loads.SOLUTION: Provided is a thermal-contact and filling material that comprises a thermally conductive filling material consisting of a metallic hydroxide and a non-silicone-contai...