Japan Intellectual Property Rights: SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND GAS SUPPLY ASSEMBLY

Japan, Feb. 27 -- TOKYO ELECTRON LTD has got intellectual property rights for 'SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND GAS SUPPLY ASSEMBLY.' Other related details are as follows:

Application Number: JP,2022-110715

Category (FI): H10P14/24,H10P14/60,101@C,H10P50/20,101@C,H01L21/302,101@C,H01L21/205,H01L21/31@C,H05H1/46@L

Stage: PROBLEM TO BE SOLVED: To improve controllability with respect to the uniformity of plasma processing.SOLUTION: A substrate processing device comprises: a processing container in which a processing space is formed between a mounting table and a metal window; and an inductive coupling antenna for generating plasma inside the processing space. The metal window includes a plurality of divided wind...