Japan Intellectual Property Rights: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Japan, Aug. 26 -- SUMCO CORP has got intellectual property rights for 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD.' Other related details are as follows:

Application Number: JP,2023-147206

Category (FI): H01L21/30,564@C,H01L21/30,569@C,H01L21/304,643@A,H01L21/304,648@L,H01L21/306@R,H10P50/60@R,H10P70/00,103@A,H10P70/00,108@L,H10P76/00,564@C,H10P76/00,569@C

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 11, 2023

Publication Date: March 24, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....