Japan, July 1 -- DEXERIALS CORP has got intellectual property rights for 'SOLDER PARTICLE MANUFACTURING METHOD, SOLDER PARTICLE AND CONDUCTIVE COMPOSITION.' Other related details are as follows:
Application Number: JP,2021-159263
Category (FI): B07B7/06,B23K35/26,310@A,B23K35/26,310@C,B23K35/40,340@F,C22C12/00,C22C13/02
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 29, 2021
Publication Date: April 10, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....