Japan, March 24 -- TDK CORP has got intellectual property rights for 'SOLDER AND ELECTRONIC COMPONENT.' Other related details are as follows:
Application Number: JP,2022-051530
Category (FI): B23K35/14@Z,B23K35/26,310@A,C22C13/00,C22C13/02,C22C38/00,302@Z,C22C38/40,C22C9/02
Stage: Grant (IP right document published.)
Filing Date: March 28, 2022
Publication Date: Oct. 11, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....