Japan, Aug. 26 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'SILICA PARTICLE, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2024-230287

Category (FI): H01L21/304,622@B,C09G1/02,H10P52/00@F,H10P52/00@H,C09K3/14,550@D,C01B33/141,H10P52/40,C01B33/18@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 26, 2024

Publication Date: March 14, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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