Japan, May 13 -- MIRISE TECHNOLOGIES CORP,TOYOTA MOTOR CORP,DENSO CORP has got intellectual property rights for 'SEMICONDUCTOR WAFER MANUFACTURING APPARATUS.' Other related details are as follows:
Application Number: JP,2022-159790
Category (FI): C23C16/34,C30B25/14,C30B29/38@D,H01L21/205,C30B25/12,H10P14/24,C23C16/458,C23C16/455
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 3, 2022
Publication Date: April 15, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....