Japan, June 10 -- TAIWAN-ASIA SEMICONDUCTOR CORP has got intellectual property rights for 'SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2024-086249
Category (FI): H01L21/283@C,H10D30/47,201,H10D30/87@Q,H10D64/60,H01L29/80@H,H01L29/50@J,H01L21/28,301@R,H01L29/80@Q,H10D64/20@F,H10D64/23@J,H10D64/62@R,H10D64/68
Stage: Grant (IP right document published.)
Filing Date: May 28, 2024
Publication Date: April 1, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....