Japan, March 25 -- SAMSUNG ELECTRONICS CO LTD has got intellectual property rights for 'SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2022-024640
Category (FI): H10W70/00,501@B,H10W70/00@K,H10W70/685,H10W70/63,H10W70/652,H01L23/12@N,H10W70/655,H01L23/12,501@B,H01L23/12@K
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 21, 2022
Publication Date: Sept. 22, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....