Japan, Feb. 12 -- SAMSUNG ELECTRONICS CO LTD has got intellectual property rights for 'SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME.' Other related details are as follows:
Application Number: JP,2023-064028
Category (FI): H01L23/36@Z,H01L23/52@C,H01L25/00@A,H01L25/00@B,H01L25/14@Z,H01L25/16@A,H10B80/00,H10W40/20@Z,H10W90/00,H10W90/00,550
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 11, 2023
Publication Date: Nov. 9, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....