Japan Intellectual Property Rights: SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING DEVICE, SEMICONDUCTOR MANUFACTURING METHOD

Japan, May 18 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING DEVICE, SEMICONDUCTOR MANUFACTURING METHOD.' Other related details are as follows:

Application Number: JP,2023-119815

Category (FI): H01L21/78@M,B24B27/06@M,B24B41/06@Z,H01L21/78@F,H10P58/00@M,H10P58/00@F,B23Q11/04

Stage: Grant (IP right granted following substantive examination.)

Filing Date: July 24, 2023

Publication Date: Feb. 5, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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