Japan, Jan. 28 -- DENSO CORP,TOYOTA MOTOR CORP,MIRISE TECHNOLOGIES CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE WITH ELECTRICAL COMPONENT BUILT INTO CIRCUIT BOARD.' Other related details are as follows:
Application Number: JP,2021-058211
Category (FI): H01L23/12@Q,H01L23/34@A,H01L25/04@C,H05K3/46@B,H05K3/46@N,H05K3/46@Q,H10W40/20@A,H10W70/62,H10W90/00,800
Stage: Grant (IP right document published.)
Filing Date: March 30, 2021
Publication Date: Oct. 13, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....