Japan, Jan. 28 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE SUBSTRATE AND JOINT MATERIAL.' Other related details are as follows:
Application Number: JP,2021-164589
Category (FI): B23K1/00,330@E,H01L23/36@C,H10W40/00,100,H10W40/20@C
Stage: Grant (IP right document published.)
Filing Date: Oct. 6, 2021
Publication Date: April 18, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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