Japan, Oct. 7 -- MIRISE TECHNOLOGIES CORP,TOYOTA MOTOR CORP,DENSO CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2023-055877

Category (FI): H01L21/52@C,H10W72/30@C,H10W70/698,H10W72/30@A,H01L23/12@F,H10W70/00@F,H01L21/52@A,H01L23/14@S

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 30, 2023

Publication Date: Oct. 11, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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