Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Japan, Feb. 27 -- MIRISE TECHNOLOGIES CORP,DENSO CORP,MITSUBOSHI DIAMOND INDUSTRIAL CO LTD,TOYOTA MOTOR CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2022-121410

Category (FI): H10W72/30@A,H10P58/00@G,H10P58/00@V,H01L21/78@G,H01L21/52@A,H01L21/78@V

Stage: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suitably suppressing unnecessary wetting and spreading of solder when solder-joining a semiconductor substrate, and a manufacturing method thereof.SOLUTION: A semiconductor device 10 comprises a semiconductor substrate 12 and a metal layer 20 provided on a surface of the semiconductor substrate. The metal...