Japan, July 14 -- CANON INC has got intellectual property rights for 'SEMICONDUCTOR DEVICE, APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-083066
Category (FI): H01L21/88@S,H10W20/41@B,H10W20/44@M,H10W20/44@X,H10W20/49@S,H10W80/00@A,H10P58/00@Q,H01L21/78@Q,H01L21/90@A,H01L21/88@M,H01L21/02@B
Stage: PROBLEM TO BE SOLVED: To improve the reliability of joining in a semiconductor device obtained by joining two semiconductor components on a joint surface.SOLUTION: A semiconductor device 1 has a first semiconductor component 10 that has a first semiconductor substrate 110 and a first wiring structure 120, and a second semiconductor component 20 that has a second ...