Japan, June 22 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE AND RESIN SEALING METHOD.' Other related details are as follows:
Application Number: JP,2022-133371
Category (FI): B29C43/18,H10W74/01@R,H01L21/56@R,B29C43/32
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 24, 2022
Publication Date: March 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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