Japan, June 22 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE AND RESIN SEALING METHOD.' Other related details are as follows:
Application Number: JP,2022-136435
Category (FI): H01L21/56@T,B29C45/14,B29C45/17,B29C45/26,H10W74/01@T
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 30, 2022
Publication Date: March 13, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....