Japan, Feb. 6 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE AND RESIN SEALING METHOD.' Other related details are as follows:
Application Number: JP,2022-011200
Category (FI): H10W74/01@R,B29C43/34,B29C45/02,H01L21/56@R,B29C43/02
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 27, 2022
Publication Date: Aug. 8, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....