Japan, Aug. 24 -- BANDAI CO LTD has got intellectual property rights for 'RESIN MOLDING.' Other related details are as follows:
Application Number: JP,2025-175713
Category (FI): B29C45/26,B29C45/13,B29C45/16
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 17, 2025
Publication Date: Dec. 25, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....