Japan, Jan. 27 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN ENCAPSULATION DEVICE AND RESIN ENCAPSULATION METHOD.' Other related details are as follows:
Application Number: JP,2022-043311
Category (FI): B29C43/32,B29C45/24,H10W74/01@R,H01L21/56@R,B29C33/72
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 18, 2022
Publication Date: Sept. 29, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....