Japan Intellectual Property Rights: RESIN COMPOSITION USED FOR SEALING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT SEALED WITH THE SAME

Japan, June 22 -- NOF CORP has got intellectual property rights for 'RESIN COMPOSITION USED FOR SEALING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT SEALED WITH THE SAME.' Other related details are as follows:

Application Number: JP,2022-057738

Category (FI): H01L23/30@R,C08G75/045,H10W74/47

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 30, 2022

Publication Date: Oct. 13, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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